产品详情
| Item | ||||
| 1 | Pedestal Size (mm) | Min: 0.6*0.6 | ||
| 2 | Pedestal to Pedestal distance (mm) | ≥1.5 | ||
| 3 | Pedestal to Outer Layer Circuit Pads(mm) | Min:0.25mm for 10Z/Min:0.35mm for 20Z | ||
| 4 | Pedestal to Inner Layer Circuit Pads(mm) | ≥0.35 | ||
| 5 | Pedestal Height-H(mm) | 0.135-0.22 | 0.20-0.29 | 0.135-0.22 |
| 6 | Dielectric thickness(mm) | 0.10-0.15 | 0.08-0.13 | 0.10-0.15 |
| 7 | Core Thickness(mm) | / | 0.05-0.10 | / |
| 8 | Pedestal Pad Flatness(um) | RA≤0.6,The flatness is ≤10 | ||
| 9 | Height Difference between Pedestal Pad and Circuit Trace (um) |
Normal≤30,Min:10 | ||
| 10 | Final Board Thickness(mm) | 1.0/1.2/1.5/2.0/3.0 | ||
| 11 | Min. Line Width & Spacing(mm), @ 1 Oz Cu | 0.1/0.1 | ||
| 12 | Max.number of circuit layer | 4 | ||
我们的金属基PCB具有卓越的导电性能、高热散率以及超强的稳定性。它提供了无与伦比的可靠性和耐用性，能够满足您在各种复杂环境下的需求。我们的产品不仅质量上乘，更以精准的生产工艺和先进的生产技术为傲。选择我们的金属基PCB，您将拥有优秀的解决方案，确保您的设备高效运行。
相关产品
Embedded Ceramic Multi-layered PCB
Embedded Copper Multi-layered PCB
Embedded Copper Multi-layered PCB
Pedestal Copper Multi-layered IMS
Thermal Via Multi-layered IMS
Thermal Via Multi-layered IMS
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
2+N+2 HDI
4 Layers FR4
8 Layers FR4
在线留言
*注：请务必信息填写准确，并保持通讯畅通，我们会尽快与你取得联系