+
  • A(1730705675926).jpg

FR4-4LAYERS

4 Layers FR4


所属分类:


关键词:


产品详情


    Capability
    Normal Advanced
1 Product Thickness, MAin./Max. (mm) 0.5-3.6 0.3-4.0
2 Min.Dielectric Thickness (mm) 0.050 0.045
3 Max.Inner Layer Copper Thickness (oz.) 5 6
4 Max.Outer Layer Copper Thickness (oz.) 5 6
5 Min. Inner Layer Line Width/Spacing (mm), @ H Oz Cu 0.065/0.065 0.050/0.050
6 Min. Outer Layer Line Width / Spacing (mm), @ 1 Oz Cu 0.090/0.090 0.075/0.075
7 Min. Mechanical Drilling Hole Diameter (mm) 0.15 0.15
8 Max. Hole Aspect Ratio, @ 0.15mm Drill Bit 8:1 10:1
9 Press Fit Hole Diameter Tolerance (mm) +0.09/-0 +0.09/-0
10 Min. Solder Mask Bridge Width (mm) 0.075 0.075
11 Min.Solder Mask Window (mm) 0.038 0.038
12 Hole to Hole Tolerance (mm) ±0.05 ±0.05
13 Min. Hole to PAD Tolerance (mm) ±0.035 ±0.035
14 Min. PAD/Hole to Breakage Tolerance (mm) ±0.05 ±0.05
15 Min.Routing Depth Tolerance (mm) ±0.05 ±0.05
16 Shape Processing CNC Routing/Punching/ Laser Cut

 

我们的金属基PCB具有卓越的导电性能、高热散率以及超强的稳定性。它提供了无与伦比的可靠性和耐用性,能够满足您在各种复杂环境下的需求。我们的产品不仅质量上乘,更以精准的生产工艺和先进的生产技术为傲。选择我们的金属基PCB,您将拥有优秀的解决方案,确保您的设备高效运行。

相关产品


MHE901RN

Embedded Ceramic Multi-layered PCB

MHE901RC-4L

Embedded Copper Multi-layered PCB

MHE901RC-2L

Embedded Copper Multi-layered PCB

MHE301RC

Pedestal Copper Multi-layered IMS

MHE301RV-2L

Thermal Via Multi-layered IMS

MHE301RV

Thermal Via Multi-layered IMS

IMS-AI

IMS with high thermal conductivity (2-10 W/mK) dielectric layer

IMS-Cu

IMS with high thermal conductivity (2-10 W/mK) dielectric layer

IMS-AI-4L

IMS with high thermal conductivity (2-10 W/mK) dielectric layer

IMS-AI(MC)

IMS with high thermal conductivity (2-10 W/mK) dielectric layer

HDI

2+N+2 HDI

FR4-4LAYERS

4 Layers FR4

FR4-8LAYERS

8 Layers FR4

在线留言

提交留言

*注:请务必信息填写准确,并保持通讯畅通,我们会尽快与你取得联系