产品详情
| Process Capability | Normal | Advanced | |
| 1 | Number of Layers | 4/6/8 | 10 |
| 2 | Thermal Conductivity (W/m.K) | ≥398 | ≥398 |
| 3 | Embedded Size, Min./Max. (mm x mm) | 5x5/35 x35 | 5x5/50x50 |
| 4 | Product Thickness (mm) | 1.0/1.2/1.5 | 2.0 |
| 5 | Tg(℃) | ≥150/≥170 | ≥150/≥175 |
| 6 | Max.Inner Layer Copper Thickness (Oz.) | 3 | 4 |
| 7 | Max.Outer Layer Copper Thickness (Oz.) | 3 | 4 |
| 8 | Min. Inner Layer Line Width / Spacing (mm), @ H Oz Cu | 0.10/0.10 | 0.075/0.075 |
| 9 | Min. Outer Layer Line Width / Spacing (mm), @ 1 Oz Cu | 0.125/0.125 | 0.10/0.10 |
| 10 | Min. Mechanical Drilled Hole Diameter (mm) | 0.200 | 0.150 |
| 11 | Min. Solder Mask Bridge Width (mm) | 0.075 | 0.075 |
| 12 | Min. Solder Mask Window (mm) | 0.038 | 0.038 |
| 13 | Hole to Hole Tolerance (mm) | ±0.050 | ±0.050 |
| 14 | Min.Hole to PAD Tolerance (mm) | ±0.035 | ±0.035 |
| 15 | Min. Hole to Breakage Tolerance (mm) | ±0.050 | ±0.050 |
| 16 | Min. PAD to Breakage Tolerance (mm) | ±0.050 | ±0.050 |
| 17 | Min.Routing Depth Tolerance (mm) | ±0.050 | ±0.050 |
我们的金属基PCB具有卓越的导电性能、高热散率以及超强的稳定性。它提供了无与伦比的可靠性和耐用性，能够满足您在各种复杂环境下的需求。我们的产品不仅质量上乘，更以精准的生产工艺和先进的生产技术为傲。选择我们的金属基PCB，您将拥有优秀的解决方案，确保您的设备高效运行。
相关产品
Embedded Ceramic Multi-layered PCB
Embedded Copper Multi-layered PCB
Embedded Copper Multi-layered PCB
Pedestal Copper Multi-layered IMS
Thermal Via Multi-layered IMS
Thermal Via Multi-layered IMS
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
2+N+2 HDI
4 Layers FR4
8 Layers FR4
在线留言
*注：请务必信息填写准确，并保持通讯畅通，我们会尽快与你取得联系