产品详情
| Capability | |||
| Normal | Advanced | ||
| 1 | Product Thickness,Min./ Max. (mm) | 0.8-2.4 | 0.6-3.2 |
| 2 | Min. Dielectric Thickness (mm) | 0.05 | 0.038 |
| 3 | Dielectric Thermal Conductivity (W/mK) | 1-10 | 1-15 |
| 4 | Max.Outer Layer Copper Thickness (oz.) | 4 | 6 |
| 5 | Min. Outer Layer Line Width / Spacing (mm), @ 1 Oz Cu | 0.1/0.1 | 0.075/0.075 |
| 6 | Min. Mechanical Drilling Hole Diameter (mm) | 0.7 | 0.6 |
| 7 | Min. Solder Mask Bridge Width (mm) | 0.075 | 0.075 |
| 8 | Min. Solder Mask Window(mm) | 0.038 | 0.038 |
| 9 | Hole to Hole Tolerance (mm) | ±0.05 | ±0.035 |
| 10 | Min. Hole to PAD Tolerance (mm) | ±0.1 | ±0.05 |
| 11 | Min. PAD to BreakageTolerance(mm) | ±0.1 | ±0.05 |
| 12 | Min. Routing Depth Tolerance (mm) | ±0.05 | ±0.035 |
| 13 | Max.number of circuit layer | 2 | 4 |
| 14 | Shape Processing | CNC Routing/ Punching/Laser Cut | |
我们的金属基PCB具有卓越的导电性能、高热散率以及超强的稳定性。它提供了无与伦比的可靠性和耐用性，能够满足您在各种复杂环境下的需求。我们的产品不仅质量上乘，更以精准的生产工艺和先进的生产技术为傲。选择我们的金属基PCB，您将拥有优秀的解决方案，确保您的设备高效运行。
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