产品详情
| Capability | |||
| Normal | Advanced | ||
| 1 | Product Thickness, Min./Max. (mm) | 0.5-3.6 | 0.3-4.0 |
| 2 | Min. Dielectric Thickness (mm) | 0.050 | 0.040 |
| 3 | Max.Inner/Outer Layer Copper Thickness (oz.) | 2/2 | 3/2 |
| 4 | Min. Inner Layer Line Width/Spacing (mm),@H Oz Cu | 0.065/0.065 | 0.050/0.050 |
| 5 | Min.Outer Layer Line Width/Spacing (mm), @ 1 Oz Cu | 0.090/0.090 | 0.075/0.075 |
| 6 | Min. Laser/Mechanical Driling Hole Diameter (mm) | 0.075/0.15 | 0.075/0.15 |
| 7 | Max.Hole Aspect Ratio of Laser/Mechanical @ 0.15mm Drill Bit | 0.75:1/8:1 | 0.90:1/10:1 |
| 8 | Laser Capture/Target Pad size(mm) | D+0.15/D+0.2 | D+0.125/D+0.175 |
| 9 | Press Fit Hole Diameter Tolerance (mm) | +0.09/-0 | +0.09/-0 |
| 10 | Min.Solder Mask Bridge Width (mm) | 0.075 | 0.075 |
| 11 | Min. Solder Mask Window (mm) | 0.038 | 0.038 |
| 12 | Hole to Hole Tolerance (mm) | ±0.05 | ±0.05 |
| 13 | Min.Hole to PAD Tolerance (mm) | ±0.035 | ±0.035 |
| 14 | Min. PAD/Hole to Breakage Tolerance (mm) | ±0.05 | ±0.05 |
| 15 | Min.Routing Depth Tolerance (mm) | ±0.05 | ±0.05 |
| 16 | Shape Processing | CNC Routing/ Punching/ Laser Cut | |
我们的金属基PCB具有卓越的导电性能、高热散率以及超强的稳定性。它提供了无与伦比的可靠性和耐用性，能够满足您在各种复杂环境下的需求。我们的产品不仅质量上乘，更以精准的生产工艺和先进的生产技术为傲。选择我们的金属基PCB，您将拥有优秀的解决方案，确保您的设备高效运行。
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