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IMS-Cu

IMS with high thermal conductivity (2-10 W/mK) dielectric layer


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产品详情


    Capability
    Normal Advanced
1 Product Thickness,Min./ Max. (mm) 0.8-2.4 0.6-3.2
2 Min. Dielectric Thickness (mm) 0.05 0.038
3 Dielectric Thermal Conductivity (W/mK) 1-10 1-15
4 Max.Outer Layer Copper Thickness (oz.) 4 6
5 Min. Outer Layer Line Width / Spacing (mm), @ 1 Oz Cu 0.1/0.1 0.075/0.075
6 Min. Mechanical Drilling Hole Diameter (mm) 0.7 0.6
7 Min. Solder Mask Bridge Width (mm) 0.075 0.075
8 Min. Solder Mask Window(mm) 0.038 0.038
9 Hole to Hole Tolerance (mm) ±0.05 ±0.035
10 Min. Hole to PAD Tolerance (mm) ±0.1 ±0.05
11 Min. PAD to BreakageTolerance(mm) ±0.1 ±0.05
12 Min. Routing Depth Tolerance (mm) ±0.05 ±0.035
13 Max.number of circuit layer 2 4
14 Shape Processing CNC Routing/ Punching/Laser Cut

 

我们的金属基PCB具有卓越的导电性能、高热散率以及超强的稳定性。它提供了无与伦比的可靠性和耐用性,能够满足您在各种复杂环境下的需求。我们的产品不仅质量上乘,更以精准的生产工艺和先进的生产技术为傲。选择我们的金属基PCB,您将拥有优秀的解决方案,确保您的设备高效运行。

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