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MHE301RV-2L

Thermal Via Multi-layered IMS


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产品详情


  Process Capability Normal Advanced
1 Number of Layers 4/6/8 10
2 Thermal Conductivity (W/m.K) ≥398 ≥398
3 Embedded Size, Min./Max. (mm x mm) 5x5/35 x35 5x5/50x50
4 Product Thickness (mm) 1.0/1.2/1.5 2.0
5 Tg(℃) ≥150/≥170 ≥150/≥175
6 Max.Inner Layer Copper Thickness (Oz.) 3 4
7 Max.Outer Layer Copper Thickness (Oz.) 3 4
8 Min. Inner Layer Line Width / Spacing (mm), @ H Oz Cu 0.10/0.10 0.075/0.075
9 Min. Outer Layer Line Width / Spacing (mm), @ 1 Oz Cu 0.125/0.125 0.10/0.10
10 Min. Mechanical Drilled Hole Diameter (mm) 0.200 0.150
11 Min. Solder Mask Bridge Width (mm) 0.075 0.075
12 Min. Solder Mask Window (mm) 0.038 0.038
13 Hole to Hole Tolerance (mm) ±0.050 ±0.050
14 Min.Hole to PAD Tolerance (mm) ±0.035 ±0.035
15 Min. Hole to Breakage Tolerance (mm) ±0.050 ±0.050
16 Min. PAD to Breakage Tolerance (mm) ±0.050 ±0.050
17 Min.Routing Depth Tolerance (mm) ±0.050 ±0.050

 

我们的金属基PCB具有卓越的导电性能、高热散率以及超强的稳定性。它提供了无与伦比的可靠性和耐用性,能够满足您在各种复杂环境下的需求。我们的产品不仅质量上乘,更以精准的生产工艺和先进的生产技术为傲。选择我们的金属基PCB,您将拥有优秀的解决方案,确保您的设备高效运行。

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